Multilayer wiring board including stacked via structure

Details Multilayer wiring board including stacked via structure Multilayer wiring board including stacked via structure

2007-01-16

2007-01-16

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

10846923

ABSTRACT:
A multilayer wiring board includes a substrate, a first planar conductor layer, a second planar conductor layer, resin dielectric layers, filled vias, and stacked via structures. Each of the stacked via structures is disposed in the resin dielectric layers and is configured such that the filled vias are stacked substantially coaxially and are mutually connected together. A first end of the stacked via structure is connected directly to either the first planar conductor layer or the second planar conductor layer. A second end of the stacked via structure is unconnected, directly, to both the first planar conductor layer and the second planar conductor layer.

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