Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1994-06-20
2000-09-26
Kincaid, Kristine
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174 524, 174 35R, H05K 116
Patent
active
061245534
ABSTRACT:
A multilayer wiring system for preventing the generation of fixing failure due to an organic residue, eliminating an increase in the number of processes and reducing an area necessary for bonding of the cap and its fabrication method. The multilayer wiring board includes at least one wiring layer made of a conductor, at least one insulating layer made of an organic matter and a board. The wiring layer and the insulating layer are alternately laminated on the board and a cap is provided for covering the insulating layer and the wiring layer. The wiring layer has a wiring pattern for forming a wiring and a frame pattern for surrounding the wiring pattern. This frame pattern includes vent holes. The insulating layer has a shield structure made of an inorganic matter around the outer peripheral portion thereof and/or in the interior thereof. The shield structure is formed of the frame patterns continuously connected to each other and the cap is joined to an uppermost layer of the shield structure.
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Matsushima Naoki
Matsuyama Haruhiko
Narizuka Yasunori
Shigi Hidetaka
Cuneo Kamand
Hitachi , Ltd.
Kincaid Kristine
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