Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture
Patent
1997-09-09
2000-07-18
Watkins, III, William P.
Stock material or miscellaneous articles
Structurally defined web or sheet
Including aperture
428138, 428131, 428901, 428414, 428212, 156300, 156311, 156312, 156330, 29825, 174259, 361757, 361761, 361739, H05K 102, C09J 400
Patent
active
060904682
ABSTRACT:
A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal expansion of 450 ppm/.degree. C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber having a glass transition point of -10.degree. C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of an epoxy resin having a weight average molecular. weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.
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Inada Teiichi
Kumashiro Yasushi
Shimada Yasushi
Yamamoto Kazunori
Hitachi Chemical Company Ltd.
Watkins III William P.
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