Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2004-07-01
2008-03-11
Dinh, Tuan T. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S766000, C361S782000, C361S793000, C361S795000, C174S255000, C174S257000, C174S258000, C174S260000, C174S261000, C174S262000, C174S263000, C174S264000, C174S265000, C174S266000, C257S687000, C257S724000
Reexamination Certificate
active
07342802
ABSTRACT:
To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers. In the multilayer wiring board, a circuit element such as an electronic part, a semiconductor chip, or a passive element is accommodated in the interlayer insulating films so as to connect its terminal with the corresponding wiring film. In particular, the semiconductor chip is polished to a thickness of 50 μm or smaller, and the multilayer wiring board itself for the electronic device has the flexibility.
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Fukuoka Yoshitaka
Iijima Tomoo
Dinh Tuan T.
Lerner David Littenberg Krumholz & Mentlik LLP
Nguyen Hoa C
Tessera Interconnect Materials, Inc.
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