Multilayer wiring board fabricating method

Details Multilayer wiring board fabricating method Multilayer wiring board fabricating method

1993-08-30

1996-01-02

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 38, 216 52, B44C 122, B29C 3700

Patent

active

054800480

ABSTRACT:
A multilayer wiring board fabricating method and a multilayer wiring board fabricated with use of the method that a solvent-free fluid polymer precursor is put on a wiring layer of a base substrate, and space among the wirings is exhausted and is filled with the precursor, and the precursor is hardened under a hydrostatic pressure and then the next wiring layer is formed before the above process is repeated one or more times. The multilayer wiring board fabricating method is excellent in the mass productivity and low cost and in that the wiring can be made highly dense with the substrate having vertical via conductors for connection among the conductor layers.

REFERENCES:
patent: 4867839 (1989-09-01), Sato et al.
patent: 5118385 (1992-06-01), Kumak et al.

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