Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-12-25
2007-12-25
Reichard, Dean A. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S255000, C174S257000, C174S258000, C174S262000, C174S264000, C428S570000, C428S209000, C257S689000, C257S252000, C257S706000, C257S637000, C257S638000, C438S639000, C438S640000, C324S765010
Reexamination Certificate
active
10505094
ABSTRACT:
A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer111); a conductive layer112formed on one surface of said insulating substrate component111in the form of an electrode pattern; an adhesive layer113formed on the other surface of said insulating substrate component111; and a conductive resin composition115with which is filled a through hole passing through said insulating substrate component111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion114bof the through hole114is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion114ato establish electrical connection between the conductive resin composition115and the conductive layer112by the rare surface112aof the conductive layer112.
REFERENCES:
patent: 04-094186 (1992-03-01), None
patent: 06-006037 (1994-01-01), None
patent: 2002-026520 (2002-01-01), None
Higuchi Reiji
Ito Shoji
Nakao Osamu
Okamoto Masahiro
Chen Xiaoliang
Fujikura Ltd.
Reichard Dean A.
Sughrue & Mion, PLLC
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