Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2006-10-17
2006-10-17
Cuneo, Kamand (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C029S830000, C029S846000, C361S792000
Reexamination Certificate
active
07122746
ABSTRACT:
A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film10made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.
REFERENCES:
patent: 5129142 (1992-07-01), Bindra et al.
patent: 5250105 (1993-10-01), Gomes et al.
patent: 5404044 (1995-04-01), Booth et al.
patent: 5435480 (1995-07-01), Hart et al.
patent: 5473120 (1995-12-01), Ito et al.
patent: 5502893 (1996-04-01), Endoh et al.
patent: 5601672 (1997-02-01), Casey et al.
patent: 6083340 (2000-07-01), Nomura et al.
patent: 6108903 (2000-08-01), Nakatani et al.
patent: 6125531 (2000-10-01), Farquhar et al.
patent: 6172307 (2001-01-01), Ostrem et al.
patent: 6184458 (2001-02-01), Murakami et al.
patent: 6195883 (2001-03-01), Bhatt et al.
patent: 6388204 (2002-05-01), Lauffer et al.
patent: 6391669 (2002-05-01), Fasano et al.
patent: 6440542 (2002-08-01), Kariya
patent: 6452117 (2002-09-01), Curcio et al.
patent: 6465084 (2002-10-01), Curcio et al.
patent: 6555208 (2003-04-01), Takada et al.
patent: 6574113 (2003-06-01), Armezzani et al.
patent: 2004/0195002 (2004-10-01), Higuchi et al.
patent: 2005/0016765 (2005-01-01), Higuchi et al.
U.S. Appl. No. 10/102,628, filed Mar. 22, 2002, Higuchi et al.
U.S. Appl. No. 10/832,433, filed Apr. 27, 2004, Higuchi et al.
K. Takagi, pp. 77-79, “Build-Up Multilayered Printed Circuit Board Technology” (with English translation).
Higuchi Reiji
Itou Shouji
Nakao Osamu
Cuneo Kamand
Fujikura Ltd.
Norris Jeremy C.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
LandOfFree
Multilayer wiring board assembly, multilayer wiring board... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer wiring board assembly, multilayer wiring board..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer wiring board assembly, multilayer wiring board... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3631700