Multilayer wiring board assembly, multilayer wiring board...

Details Multilayer wiring board assembly, multilayer wiring board... Multilayer wiring board assembly, multilayer wiring board...

2005-07-05

2005-07-05

Gibson, Randy W. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S262000, C361S792000

Reexamination Certificate

active

06914199

ABSTRACT:
A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components having a flexible resin film with a copper foil bonded to one surface and an adhesive layer bonded to the other surface, opening a through hole in the copper plated resin film through the copper foil, resin film, and the adhesive layer, filling the through hole with a conductive paste projecting from the adhesive layer and laterally extending beyond through hole opening of the copper foil.

REFERENCES:
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 5473120 (1995-12-01), Ito et al.
patent: 5633069 (1997-05-01), Shimizu et al.
patent: 5888627 (1999-03-01), Nakatani
patent: 6320140 (2001-11-01), Enomoto
patent: 6420017 (2002-07-01), Matsuda et al.
patent: 6831236 (2004-12-01), Higuchi et al.
patent: 2004/0195002 (2004-10-01), Higuchi et al.

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