Multilayer wiring board assembly, multilayer wiring board...

Details Multilayer wiring board assembly, multilayer wiring board... Multilayer wiring board assembly, multilayer wiring board...

2005-07-05

2005-07-05

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S258000, C174S261000

Reexamination Certificate

active

06914200

ABSTRACT:
A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film10made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.

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K. Takagi, pps. 77-79, “Build-Up Multilayered Printed Circuit Board Technology” (with English translation).

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