Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-08-15
2006-08-15
Owens, Douglas W (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S703000
Reexamination Certificate
active
07091589
ABSTRACT:
In a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface of said core board, a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode being the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer.
REFERENCES:
patent: 4446188 (1984-05-01), Patel et al.
patent: 6465084 (2002-10-01), Curcio et al.
patent: 2001/0032700 (2001-10-01), Nishii et al.
patent: 2002/0159243 (2002-10-01), Ogawa et al.
patent: 7-030225 (1995-01-01), None
patent: 9-283884 (1997-10-01), None
patent: 11-340226 (1999-12-01), None
patent: 2000-165052 (2000-06-01), None
patent: 2001-015928 (2001-01-01), None
patent: 2001-257474 (2001-09-01), None
patent: 2002-141626 (2002-05-01), None
Akazawa Miyuki
Kuramochi Satoru
Mori Toshiaki
Nakamura Kazunori
Nakayama Koichi
Dai Nippon Printing Co. Ltd.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Owens Douglas W
LandOfFree
Multilayer wiring board and manufacture method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer wiring board and manufacture method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer wiring board and manufacture method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3630977