Multilayer wiring board and its manufacturing method

Details Multilayer wiring board and its manufacturing method Multilayer wiring board and its manufacturing method

2006-04-26

2011-12-13

Norris, Jeremy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S257000, C361S792000

Reexamination Certificate

active

08076589

ABSTRACT:
A multilayer wiring board employs a thin insulating substrate having substantially only resin flow as the compression property effect, and has an any-layer IVH structure where at least one core layer is formed without burying wiring. For sufficiently securing an effective compression amount of the crush-allowance of a conductor, the ratio of the thickness of a cover film to that of the electrical insulating substrate is increased, and a via can be formed in the core layer without burying the wiring in the insulating substrate. Thus, a multilayer wiring board having an any-layer IVH structure that can achieve high-density component mountability and wiring storability in an extremely small thickness can be provided.

REFERENCES:
patent: 6300576 (2001-10-01), Nakamura et al.
patent: 6700071 (2004-03-01), Takenaka et al.
patent: 6780493 (2004-08-01), Noda et al.
patent: 2003/0082363 (2003-05-01), Nakagiri et al.
patent: 7-283534 (1995-10-01), None
patent: 8-018238 (1996-01-01), None
patent: 11-298105 (1999-10-01), None
patent: 2000-077800 (2000-03-01), None
patent: 2002-064270 (2002-02-01), None
Abstract and machine translation of Japanese Patent Application No. 08-018238, Jun. 24, 1994.

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