Multilayer wiring board and its manufacturing method

Details Multilayer wiring board and its manufacturing method Multilayer wiring board and its manufacturing method

2011-03-29

2011-03-29

Patel, Ishwarbhai B (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S254000

Reexamination Certificate

active

07915538

ABSTRACT:
A multilayer wiring board having a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation. In the multilayer wiring board, all the resin layers and the wiring layers, except a resin layer in the plurality of wiring boards, are separated in a same position between the plurality of wiring boards and the resin layer is continuous in the same position.

REFERENCES:
patent: 5047279 (1991-09-01), Nasu et al.
patent: 5773764 (1998-06-01), von Vajna
patent: 6239381 (2001-05-01), Kasai et al.
patent: 7355124 (2008-04-01), Ikumo et al.
patent: 10-027971 (1998-01-01), None
patent: 10-135157 (1998-05-01), None
patent: 2000-151102 (2000-05-01), None
patent: 2004-319607 (2004-11-01), None
Japanese Office Action dated Oct. 12, 2010 (mailing date), issued in related Japanese Patent Application No. 2005-105232 with its partial English language translation.

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