Multilayer wiring board and electrical connecting apparatus...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Reexamination Certificate

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08064218

ABSTRACT:
The present invention makes repair easy and reduces effects on the electrical connection conditions of an electronic component to an internal wiring after repair and on the mechanical strength of the repair part in a case of breakage or separation of an electrode for implementation of the electronic component. In a multilayer wiring board, a plurality of wiring sheets each having an internal wiring and a plurality of electrical insulating sheets are arranged alternately in the thickness directions of these sheets, and a plurality of electrodes for implementing an electronic component electrically connected to the internal wirings are formed on the surface of an uppermost sheet. The multilayer wiring board further comprises a plurality of spare electrodes corresponding to the electrodes and electrically connected to the internal wirings connected to the corresponding electrodes directly under the corresponding electrodes on a sheet located directly under the uppermost sheet.

REFERENCES:
patent: 6825900 (2004-11-01), Kawashima
patent: 5218218 (1993-08-01), None
patent: 5218218 (1993-08-01), None
patent: 6152141 (1994-05-01), None
patent: 6152141 (1994-05-01), None
patent: 2961859 (1999-10-01), None
patent: 2961859 (1999-10-01), None
patent: 2006120738 (2006-05-01), None
patent: 2006120738 (2006-05-01), None

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