Multilayer wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C361S777000

Reexamination Certificate

active

08076588

ABSTRACT:
A multilayer wiring board having a structure in which wiring layers12A to12D and insulating layers11A to11C are alternately arranged, and in which one or plural kinds of wirings selected from a group of a signal wiring25having a signal electrode15, a power supply wiring26having a power supply electrode16, and a ground wiring27having a ground electrode17are formed on each of the wiring layers12A to12D. The signal wiring25and the power supply wiring26are alternately provided on the insulating layers. Alternatively, the signal wiring25and the ground wiring27are alternately provided on the insulating layers.

REFERENCES:
patent: 4675789 (1987-06-01), Kuwabara et al.
patent: 6800814 (2004-10-01), Ohsaka
patent: 6900992 (2005-05-01), Kelly et al.
patent: 2006/0200977 (2006-09-01), Lauffer et al.
patent: 63-136694 (1988-06-01), None
patent: 07-263869 (1995-10-01), None
patent: 10-041637 (1998-02-01), None
patent: 2001-274553 (2001-10-01), None
patent: 2002-093940 (2002-03-01), None
patent: 2004-140295 (2004-05-01), None

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