Multilayer wiring board

Details Multilayer wiring board Multilayer wiring board

2006-02-21

2006-02-21

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C428S209000

Reexamination Certificate

active

07002080

ABSTRACT:
A multilayer wiring board is composed of a core portion, a first wiring portion and a second wiring portion. The core portion includes a core insulating layer containing a carbon fiber material. The first wiring portion is bonded to the core portion and has a laminated structure including at least a first insulating layer and a first wiring pattern, the first insulating layer containing glass cloth. The second wiring portion is bonded to the first wiring portion and has a laminated structure including at least a second insulating layer and a second wiring pattern. The core portion, the first wiring portion and the second wiring portion are arranged in a stack.

REFERENCES:
patent: 4591659 (1986-05-01), Leibowitz
patent: 4689110 (1987-08-01), Leibowitz
patent: 4812792 (1989-03-01), Leibowitz
patent: 5350621 (1994-09-01), Yuhas et al.
patent: 5825629 (1998-10-01), Hoebener et al.
patent: 6013588 (2000-01-01), Ozaki
patent: 6222740 (2001-04-01), Bovensiepen et al.
patent: 6274821 (2001-08-01), Echigo et al.
patent: 6613413 (2003-09-01), Japp et al.
patent: 6869665 (2005-03-01), Tani et al.
patent: 2002/0139578 (2002-10-01), Alcoe et al.
patent: 2002/0157859 (2002-10-01), Vasoya et al.
patent: 2000-138453 (2000-05-01), None

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