Multilayer via resistors

Details Multilayer via resistors Multilayer via resistors

1980-06-02

1981-11-10

Albritton, C. L.

Electrical resistors

With base extending along resistance element

Resistance element and base formed in layers

29610R, 338260, 338320, H01C 1012

Patent

active

043001157

ABSTRACT:
A substrate has two or more conductive layers deposited thereon, each adjnt layer pair separated by a dielectric layer. Apertures are formed in the dielectric layer and are filled with resistor paste. In this way, a resistive path may be formed between the conductive layers. This concept of fabricating resistors are particularly useful in the inclusion of pull-up, pull-down and other non-critical resistors in the circuitry contained within a thick film construction.

REFERENCES:
patent: 3210831 (1965-10-01), Johnson et al.
patent: 3670214 (1972-06-01), Hagen
patent: 3727165 (1973-04-01), Hagen
patent: 4179797 (1979-12-01), Johnson

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