Multilayer through hole connections

Details Multilayer through hole connections Multilayer through hole connections

1990-10-12

1991-09-24

Abrams, Neil

Metal working

Method of mechanical manufacture

Electrical device making

174266, H05K 102

Patent

active

050502956

ABSTRACT:
A method of providing a through-hole connection between conductive layers of a multilayer circuit board assembly whose thickness is liable to expansion and contraction is described. The method includes inserting into through-holes in adjacent boards a tubular flexible conductive member and expanding that member in a position intermediate its ends to engage the through-holes. The boards are then urged together to further expand the tubular member so as to retain that member in the through-holes. Typically the conductive member comprises a tubular braid.

REFERENCES:
patent: 2938068 (1960-05-01), Silverschotz
patent: 4070077 (1978-01-01), Clark
patent: 4562301 (1985-12-01), Kameda et al.
patent: 4889496 (1989-12-01), Neidich

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