Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-08-02
2011-08-02
Dinh, Tuan T (Department: 2835)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S852000, C174S657000
Reexamination Certificate
active
07987589
ABSTRACT:
A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit structure is then formed on a surface of the three-dimensional insulating structure. Next, an insulating layer covering the first three-dimensional circuit structure is formed. Thereafter, a second three-dimensional circuit structure is formed on the insulating layer. Subsequently, at least a conductive via penetrating the insulating layer is formed for electrically connecting the second three-dimensional circuit structure and the first three-dimensional circuit structure.
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Huang Han-Pei
Yu Cheng-Hung
Dinh Tuan T
J.C. Patents
Sawyer Steven
Unimicron Technology Corp.
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