Multilayer thin-film wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Patent

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Details

174262, 361792, 361794, 361777, H05K 100

Patent

active

056081928

ABSTRACT:
A multilayer thin-film wiring board formed by laminating at least three wiring layers including first, second, and third wiring layers together with a dielectric layer. The first wiring layer includes a first pattern having a plurality of first windows arranged with the same pitch both in a lateral direction and in a longitudinal direction of the wiring board, and a plurality of first island patterns each located at a substantially central portion of each first window. Similarly, the second wiring layer includes a second pattern having a plurality of second windows, and a plurality of second island patterns each located at a substantially central portion of each second window. The second windows are shifted from the first windows by half the pitch both in the lateral direction and in the longitudinal direction. The third wiring layer includes first and second via pads formed on a surface of the wiring board. The first via pad, the first pattern, and at least one of the second island patterns are connected together by a first via. The second via pad, the second pattern, and at least one of the first island patterns are connected together by a second via.

REFERENCES:
patent: 4227298 (1980-10-01), Keeling et al.
patent: 4438560 (1984-03-01), Kisters
patent: 4524239 (1985-06-01), Rouge
patent: 4524240 (1985-06-01), Stock et al.
patent: 4560962 (1985-12-01), Barrow
patent: 4616292 (1986-10-01), Sengoku et al.
patent: 5003374 (1991-03-01), Vokoun, II

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