Multilayer thin film metallurgy for pin brazing

Details Multilayer thin film metallurgy for pin brazing Multilayer thin film metallurgy for pin brazing

1986-05-07

1989-05-30

Tarcza, Thomas H.

357 74, 357 80, H01L 2348

Patent

active

048355933

ABSTRACT:
A multilayered thin film structure for attaching input/output pins to a ceramic substrate, and method of making the thin film structure are disclosed. A thin adhesion layer, which can suitably be a refractory metal such as titanium, vanadium, chromium or tantalum, is first formed on the surface of the substrate. A thick stress reducing layer of soft metal such as copper, silver, nickel, aluminum, gold or iron is subsequently formed over the adhesion layer. To prevent the soft metal from reacting with subsequently brazed gold-tin pin eutectic alloy, a reaction barrier layer which can be titanium or zirconium is then deposited over the soft stress reducing metal cushion layer. The process is completed by finally depositing a gold layer over the reaction barrier layer.

REFERENCES:
patent: 3576722 (1971-04-01), Fennimore et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4109297 (1978-08-01), Lesh et al.

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