Multilayer thick-film hybrid circuits method and process for con

Details Multilayer thick-film hybrid circuits method and process for con Multilayer thick-film hybrid circuits method and process for con

1974-07-03

1976-04-06

Lanham, C. W.

Metal working

Method of mechanical manufacture

Electrical device making

156 89, 174 685, 264 61, 317101B, H05K 300

Patent

active

039479560

ABSTRACT:
A method and process of screening multilayer thick-film structures to produce complex hybrid electronic circuits. After deposition, drying and firing of the first conductor plane on the substrate, registration ink is deposited and allowed to dry thus forming temporary vias. A suitable dielectric paste is then deposited either on all the surface or except on viaslocations. The dielectric paste is then dried and fired. Firing however causes sublimation or evaporation of the temporary vias pattern leaving cavities in the dielectric layer. Slight buffing may be required to uncover the via holes. The vias and the second conductor plane are then deposited, dried and fired. The same steps are carried out for each subsequent conductor plane.

REFERENCES:
patent: 3770529 (1973-11-01), Anderson
patent: 3772748 (1973-11-01), Rutt
patent: 3798762 (1974-03-01), Harris et al.
patent: 3852877 (1974-12-01), Ahn et al.
IBM Technical Disclosure Bull., "Capillary Forming Paste," Ahn, Miller, Wilcox, Vol. 8, No. 10, Mar. 1966, pp. 1307-1308.

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