Coating processes – Electrical product produced – Welding electrode
Patent
1985-07-18
1987-04-14
Smith, John D.
Coating processes
Electrical product produced
Welding electrode
29846, 156901, 204 15, 204 384, 204 385, 2041921, 427 96, 427 97, 427 98, 427 99, 4273835, 430314, 148 631, H05K 346
Patent
active
046577785
ABSTRACT:
A method of producing a multilayer system comprises depositing a seed layer (4) of copper on an electrically insulating substrate (2). A resist is formed on the copper seed layer (4), and the seed layer is electroplated with copper to produce a desired conductor pattern (8). An air firing dielectric (10) is screen printed over the pattern (8) and the exposed parts of the seed layer (4) are fired in air. The outer skin of the pattern is oxidized as is also the whole of the seed layer other than where it underlies the copper pattern. The ozidized regions of the copper both form a firm bond with the dielectric and inhibit the migration of oxygen into the inner regions of the conductor pattern (8). Also the oxidation of the seed layer renders it non-conductive and therefore obviates the need for its removal. Through holes (12) produced in the dielectric enable electrical connection to the pattern (8).
REFERENCES:
patent: 3576668 (1971-04-01), Fenster
patent: 3978248 (1976-08-01), Usami
patent: 4159357 (1979-06-01), Grunke
patent: 4434544 (1984-03-01), Dohya
patent: 4504339 (1985-03-01), Kamehara
patent: 4551357 (1985-11-01), Takeuchi
patent: 4569902 (1986-02-01), Saito
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