Multilayer systems and their method of production

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428210, 428620, B22B 300

Patent

active

048912590

ABSTRACT:
A multilayer system comprises a seed layer (4) of copper deposited on an electrically insulating substrate (2). The seed layer (4) carries a copper pattern (8). An air fired dielectric (10) encapsulates the pattern (8) and the exposed parts of the seed layer (4). The outer skin of the pattern is oxidized as is also the whole of the seed layer other than where it underlies the copper pattern. The oxidized regions of the copper both form a firm bond with the dielectric and inhibit the migration of oxygen into the inner regions of the conductor pattern (8). Also the oxidation of the seed layer renders it non-conductive and therefore obviates the need for its removal. Through holes (12) produced in the dielectric enable electrical connection to the pattern (8).

REFERENCES:
patent: 4109377 (1978-08-01), Blazick
patent: 4409261 (1983-10-01), Kuo
patent: 4440823 (1984-04-01), Hoffmann
patent: 4497875 (1985-02-01), Arakawa
patent: 4503112 (1985-03-01), Konicek
patent: 4568562 (1986-02-01), Phillips
patent: 4606788 (1986-08-01), Moran

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