Multilayer substrate manufacturing method

Details Multilayer substrate manufacturing method Multilayer substrate manufacturing method

2005-02-24

2010-02-16

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S846000, C029S847000, C174S255000, C174S264000, C438S126000

Reexamination Certificate

active

07661191

ABSTRACT:
A manufacturing method of a multilayer substrate that suppresses relative displacement of layers and forms interconnecting portions electrically connecting layers having an accurate positioning. A manufacturing method of a multilayer substrate for laminating, via an insulating film, a wiring layer formed by patterning a conductive film comprises providing a positioning hole in a conductive film laminated at the beginning and patterning a second and/or any subsequent wiring layers after identifying a position of an identification section. Interconnecting sections for interconnecting wiring layers are formed using the identification section.

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