Multilayer substrate

Details Multilayer substrate Multilayer substrate

1997-09-09

1999-08-24

Donovan, Lincoln

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

174255, 336232, H01F 520

Patent

active

059429658

ABSTRACT:
When a multilayer substrate is formed by alternately laminating a plurality of substrates having coil patterns and preimpregs including an epoxy resin, and by pressing in the direction of lamination while heating, the epoxy resin is melted and may leak from between the substrates, and may form voids between the coil patterns so as to render the electrical insulation therebetween unsatisfactory. According to the present invention, a fence pattern or another structure is formed around each coil pattern, which substantially prevents leakage of the melted epoxy resin from between the substrates, and therefore, the spaces between the coil patterns remain securely filled with the epoxy resin.

REFERENCES:
patent: 3785046 (1974-01-01), Jennings
patent: 4313151 (1982-01-01), Vranken
patent: 4313152 (1982-01-01), Vranken
patent: 5363081 (1994-11-01), Bando et al.
Dialog English Abstract of Japan Publication No. 7-122430, May 12, 1995.

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