Multilayer-structured bolometer and method of fabricating...

Radiant energy – Invisible radiant energy responsive electric signalling – Infrared responsive

Reexamination Certificate

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C257SE21001

Reexamination Certificate

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07667202

ABSTRACT:
Provided are a multilayer-structured bolometer and a method of fabricating the same. In the multilayer-structured bolometer, the number of support arms supporting the body of a sensor structure is reduced to one, and two electrodes are formed on the one support arm. Thus, the sensor structure is electrically connected with a substrate through the only one support arm. According to the multilayer-structured bolometer and method of fabricating the bolometer, the thermal conductivity of the sensor structure is considerably reduced to remarkably improve sensitivity to temperature, and also the pixel size of the bolometer is reduced to obtain high-resolution thermal images. In addition, the multilayer-structured bolometer can have a high fill-factor due to a sufficiently large infrared-absorbing layer, and thus can improve infrared absorbance.

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patent: 6690014 (2004-02-01), Gooch et al.
patent: 10-332480 (1998-12-01), None
Murphy et al., “640×512 17 μm microbolometer FPA and sensor development”, Infrared Technology and Applications XXXIII, Proceedings of the SPIE, vol. 6542, No. 65421Z, 2007, p. 1-10.
Li et al., “Recent development of ultra small pixel uncooled focal plane arrays at DRS”, Infrared Technology and Applications XXXIII, Proceedings of the SPIE, vol. 6542, No. 65421Y, 2007, p. 1-12.

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