Multilayer structure for polymers

Details Multilayer structure for polymers Multilayer structure for polymers

2011-01-04

2011-01-04

Blackwell, Gwendolyn (Department: 1784)

Stock material or miscellaneous articles

Composite

Of silicon containing

C428S446000, C428S689000, C428S697000, C428S701000, C428S702000

Reexamination Certificate

active

07862899

ABSTRACT:
The invention relates to a multilayer structure which is especially suitable for the anti-scratch sealing and decorative metallic finishing of topographically defined polymer surfaces, and to vacuum methods for building up the series of layers.

REFERENCES:
patent: 5846649 (1998-12-01), Knapp et al.
patent: 6440569 (2002-08-01), Kanamori et al.
patent: 40 39 352 (1992-06-01), None
patent: 44 38 359 (1996-05-01), None
patent: 195 23 442 (1997-01-01), None
patent: 198 08 180 (1999-09-01), None
patent: 199 01 834 (2000-07-01), None
patent: 101 39 305 (2003-03-01), None
patent: WO-03/102056 (2003-12-01), None
patent: WO 2004/069904 (2004-08-01), None
International Search Report dated Aug. 30, 2005 issued in PCT/EP2005/006440.
German Patent Office Action, dated Nov. 17, 2004, issued for corresponding German Application No. 10 2004 032 013.6 (and partial English translation).
Klaus W. Mertz, Hermann A. Jehn, “Praxishandbuch Moderne Beschichtungen” (Operating Manual for Modern Coatings), Carl Hanser 2001, Chapters 1.2, 1.3, Tribological Layers.
Markus Riester, “Berichte Aus Der Chemie, Titannitrid Auf Thermoplasten” (Reports from the Field of Chemistry, Titanium Nitride on Thermoplastic Materials), Publishing House Shaker, 1998, p. 17, overview of samples, p. 64, crack formation.

Affiliated with

Also associated with

Rating

Multilayer structure for polymers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer structure for polymers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer structure for polymers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2649847