Multilayer structure and multilayer wiring board using the same

Details Multilayer structure and multilayer wiring board using the same Multilayer structure and multilayer wiring board using the same

2007-08-07

2007-08-07

Woodward, Ana (Department: 1711)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C174S258000, C174S259000, C428S354000, C428S209000, C428S35500R, C428S458000, C428S473500

Reexamination Certificate

active

10257502

ABSTRACT:
A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.

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