Multilayer sheet, production method thereof and...

Details Multilayer sheet, production method thereof and... Multilayer sheet, production method thereof and...

2011-07-12

2011-07-12

Tran, Thao T. (Department: 1794)

Stock material or miscellaneous articles

Composite

Of polyamidoester

C428S424200

Reexamination Certificate

active

07976952

ABSTRACT:
To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.

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Japanese Office Action dated Apr. 27, 2010.

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