Multilayer semiconductor device having high packing density

Details Multilayer semiconductor device having high packing density Multilayer semiconductor device having high packing density

1997-04-21

1999-01-05

Feild, Lynn D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361762, 361764, 361772, 361749, 361777, 361750, 361751, 361807, 257778, 257781, 257782, 257783, 257736, 257750, 257753, 257762, 174255, 174250, 174256, 174260, H05K 116

Patent

active

058569138

ABSTRACT:
A semiconductor power module has semiconductor components mounted on a substrate. The semiconductor components are in electrical contact with the substrate. Internal circuit wiring is achieved by using one or more flexible circuit boards. The flexible circuit board(s) contact the semiconductor components and also provide external connection elements. Hermetical encapsulation is achieved by lamination, and height equalization of the different circuit regions is achieved by using geometrically preformed prepregs in conjunction with the flexible circuit board and the substrate.

REFERENCES:
patent: 4800461 (1989-01-01), Dixon et al.
patent: 5313367 (1994-05-01), Ishiyama
patent: 5633480 (1997-05-01), Sato et al.
patent: 5646446 (1997-07-01), Nicewarner, Jr. et al.

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