Multilayer semiconductor device

Details Multilayer semiconductor device Multilayer semiconductor device

2006-06-07

2009-12-01

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

07626126

ABSTRACT:
A multilayer semiconductor device has plural semiconductor devices, each having a circuit board for a ball grid array and a semiconductor chip provided on the board. The semiconductor boards are bonded together by a reflow mounting process to use a solder ball for interlayer connection so as to form a multilayer structure. The plural semiconductor devices each have a projection for restricting inclination of the circuit board, and the projection is provided between neighboring two of the circuit boards.

REFERENCES:
patent: 6239383 (2001-05-01), Lin
patent: 6400033 (2002-06-01), Darveaux
patent: 6642626 (2003-11-01), Park
patent: 6778404 (2004-08-01), Bolken et al.
patent: 2004/0036181 (2004-02-01), Hedler et al.
patent: 2006/0247343 (2006-11-01), Kishimoto et al.
patent: 2002-76265 (2002-03-01), None
patent: 2003-133519 (2003-05-01), None

Affiliated with

Also associated with

Rating

Multilayer semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4132176