Multilayer semiconductor device

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S765010

Reexamination Certificate

active

07466158

ABSTRACT:
The present invention is applied to a multilayer semiconductor device including a plurality of layered semiconductor chips. At least one of the plurality of layered semiconductor chips comprises a pad that is not connected to any external circuit terminal of the multilayer semiconductor device. The multilayer semiconductor device further comprises a separating element that connects the pad to a test stub line when each semiconductor chip is tested and separates the pad from the test stub line during the normal operation.

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patent: 6987383 (2006-01-01), Kusumoto
patent: 7298157 (2007-11-01), Kim
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patent: 11-274395 (1999-10-01), None
patent: 2000-227457 (2000-08-01), None
patent: 2000-332192 (2000-11-01), None
patent: 2002-217367 (2002-08-01), None
patent: WO 02/082540 (2002-10-01), None

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