Metal fusion bonding – Process – Plural joints
Patent
1991-06-06
1993-01-12
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228214, 228222, H05K 334
Patent
active
051783185
ABSTRACT:
A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.
REFERENCES:
patent: 3409732 (1968-11-01), Dahlgren et al.
patent: 4075420 (1978-02-01), Walton
patent: 4424095 (1984-01-01), Frisch et al.
patent: 4800461 (1989-01-01), Dixon et al.
patent: 4838475 (1989-06-01), Mullins et al.
patent: 4885841 (1989-12-01), McNabb
patent: 4965227 (1990-10-01), Chang et al.
patent: 4998342 (1991-03-01), Bonnell et al.
patent: 5048166 (1991-09-01), Wakamatsu
patent: 5072074 (1991-12-01), Demaso et al.
Edwin Eric R.
McKenney Darryl J.
McMillan, Jr. Thad C.
Meyer Rollin G.
Tumlinson James J.
Compaq Computer Corp.
Heinrich Samuel M.
LandOfFree
Multilayer rigid-flex printed circuit boards for use in infrared does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer rigid-flex printed circuit boards for use in infrared, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer rigid-flex printed circuit boards for use in infrared will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1214750