Multilayer rigid-flex printed circuit boards for use in infrared

Details Multilayer rigid-flex printed circuit boards for use in infrared Multilayer rigid-flex printed circuit boards for use in infrared

1990-10-12

1993-11-16

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 29846, 428901, H05K 100

Patent

active

052625940

ABSTRACT:
A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.

REFERENCES:
patent: 3409732 (1968-11-01), Dahlgren et al.
patent: 4424094 (1984-01-01), Frisch et al.
patent: 4800461 (1989-01-01), Dixon et al.
patent: 4951400 (1990-08-01), Elliott et al.
patent: 4959900 (1990-10-01), de Givry et al.
patent: 4965227 (1990-10-01), Chang et al.

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