Multilayer printed wiring board with single layer vias

Details Multilayer printed wiring board with single layer vias Multilayer printed wiring board with single layer vias

1988-11-30

1991-03-19

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

174266, H05K 111

Patent

active

050016059

ABSTRACT:
The top board (12) in multi-layer printed wiring board (10) has a conductor (48) on its underside leading from the principal via (20) to small via (54). The small via is filled with resin material so that it is plated level over with copper layer (62) and solder layer (64). When leadless chip carrier (66) is attached, there is no place for the solder layer (64) to run to starve the joint to result in reliable solder attachment.

REFERENCES:
patent: 4150421 (1979-04-01), Nishihara et al.
patent: 4325780 (1982-04-01), Schulz, Sr.
patent: 4434321 (1984-02-01), Betts
patent: 4785141 (1988-11-01), Nishihara et al.

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