Multilayer printed wiring board with plurality of ground layers

Details Multilayer printed wiring board with plurality of ground layers Multilayer printed wiring board with plurality of ground layers

1996-07-02

1998-02-17

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 333181, 361780, 361782, H05K 111, H05K 702

Patent

active

057197504

ABSTRACT:
A printed board 10 is provided with two ground layers 3a, 3b. These ground layers 3a, 3b are electrically insulated inside the printed board. By connecting circuits with different characteristics (low frequency and high frequency, for example) with the different ground layers 3a, 3b, interference of these circuits caused due to a common ground can be minimized.

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patent: 4984132 (1991-01-01), Sakurai et al.
patent: 5023753 (1991-06-01), Abe
patent: 5068631 (1991-11-01), Vince
patent: 5363280 (1994-11-01), Chobot et al.
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patent: 5376759 (1994-12-01), Marx et al.
patent: 5475606 (1995-12-01), Muyshondt et al.
Machine Design Technical Brief 903 "Minimizing Noise in Digital PCB Layouts"No. 20 pp. 144 and 146 Sep. 1984.

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