Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1991-10-17
1995-01-17
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174250, 174265, 361767, 361784, 361785, 361792, 361794, 361795, H05K 100
Patent
active
053827570
ABSTRACT:
The multilayer printed wiring board of this invention consists of a base substrate, a plurality of multilayer interconnections formed by lamination of metal wiring layer and insulation layer on the base substrate and ceramic substrates provided with through holes for electrical connection of the multilayer interconnections and inserted between two multilayer interconnections. The manufacturing method comprises lamination of metal wiring layers and insulation layers on both sides of ceramic substrates to form multilayer interconnections, forming of a multilayer interconnection on the base substrate by laminating a wiring layer and an insulation layer, and integration of the ceramic substrates with metal wiring layers and the base substrate placed together under heated and pressurized conditions.
REFERENCES:
patent: 4541035 (1985-09-01), Carlson et al.
patent: 4736521 (1988-04-01), Dohya
patent: 4963697 (1990-10-01), Peterson et al.
R. J. Jensen et al, "Copper/Polyimide Materials System for High Performance Packaging", IEEE, 1984, pp. 73-81.
Figlin Cheryl R.
NEC Corporation
Picard Leo P.
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