Multilayer printed wiring board and process for manufacturing th

Details Multilayer printed wiring board and process for manufacturing th Multilayer printed wiring board and process for manufacturing th

1996-05-01

1998-09-01

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 20, 216 33, 216 41, B44C 122

Patent

active

058007229

ABSTRACT:
A multilayer printed wiring board wherein an inner-layer copper circuit is provided on one or both of the surfaces of an inner-layer substrate, and subsequent copper circuit is cumulatively provided through an insulating layer on the outside of the inner-layer copper circuit, characterized in that the inner-layer copper circuit has a cuprous oxide film formed on the surface thereof the insulating layer which remarkably facilitate the interlayer adhesion between the inner-layer copper circuit. This multilayer printed wiring board has high interlayer adhesiveness and moistureproofness without causing any haloing phenomena when soaked with an acidic solution.

REFERENCES:
patent: 2852421 (1958-09-01), Bergstedt
patent: 3172921 (1965-03-01), Flowers
patent: 4775444 (1988-10-01), Cordani
patent: 4985294 (1991-01-01), Watanabe et al.
patent: 5501350 (1996-03-01), Yoshida et al.

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