Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2008-05-06
2008-05-06
Gurley, Lynne (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S776000, C257S698000, C257S703000, C257S700000, C257S738000, C257S689000, C257SE23069
Reexamination Certificate
active
11134426
ABSTRACT:
In a multilayer printed wiring board having a plurality of laminated resin layers, a plurality of wiring patterns formed on the interfacial surface of the resin layers, and a plurality of lands formed on the outermost layer of the resin layers and on which the solder is provided, at least one of the wiring patterns has a plurality of openings in the form of a mesh, the size of openings of the wiring patterns in a region corresponding to the position of solder in which a stress generated in the solder provided on the lands becomes a value larger than a desired value due to thermal deformation of the semiconductor device and the multilayer printed wiring board is larger than that of openings in the other regions.
REFERENCES:
patent: 6429114 (2002-08-01), Hayama et al.
patent: 6749927 (2004-06-01), Cooray
patent: 5-343820 (1993-12-01), None
patent: 2002-100880 (2002-04-01), None
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Gurley Lynne
Im Junghwa
LandOfFree
Multilayer printed wiring board and multilayer printed... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer printed wiring board and multilayer printed..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed wiring board and multilayer printed... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3956383