Multilayer printed wiring board and method of producing...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S255000, C174S266000, C361S795000

Reexamination Certificate

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06930258

ABSTRACT:
Through holes36are formed to penetrate a core substrate30and lower interlayer resin insulating layers50, and via holes66are formed right on the through holes36, respectively. Due to this, the through holes36and the via holes66are arranged linearly, thereby making it possible to shorten wiring length and to accelerate signal transmission speed. Also, since the through holes36and the via holes66to be connected to solder bumps76(conductive connection pins78), respectively, are directly connected to one another, excellent reliability in connection is ensured.

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