Multilayer printed wiring board and method of making same

Details Multilayer printed wiring board and method of making same Multilayer printed wiring board and method of making same

1997-02-04

1999-09-28

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29831, 29847, 29853, 174257, 174258, 174259, 174264, 427 97, H05K 340, H05K 342, H05K 346, H05K 338

Patent

active

059568437

ABSTRACT:
A multilayered printed wiring board includes two or more layers each having a via hole therein, these holes aligned vertically above one another to minimize board real estate while assuring an effective circuit path between respective points on the two layers. One or both via holes can be filled with either an electrically conductive material (e.g., copper paste) or a nonconductive material (e.g., resin).

REFERENCES:
patent: 3471631 (1969-10-01), Quintana
patent: 4908940 (1990-03-01), Amano et al.
patent: 5042148 (1991-08-01), Tada et al.
patent: 5108785 (1992-04-01), Lincoln et al.
patent: 5231751 (1993-08-01), Sachdev et al.
patent: 5323520 (1994-06-01), Petero et al.
patent: 5699613 (1997-12-01), Chong et al.

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