Multilayer printed wiring board and method of making same

Details Multilayer printed wiring board and method of making same Multilayer printed wiring board and method of making same

1996-02-01

1997-09-02

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428901, 174257, 174262, 174264, B32B 900

Patent

active

056629877

ABSTRACT:
A multilayered printed wiring board includes two or more layers each having a via hole therein, these holes aligned vertically above one another to minimize board real estate while assuring an effective circuit path between respective points on the two layers. One or both via holes can be filled with either an electrically conductive material (e.g., copper paste) or a non-conductive material (e.g., resin).

REFERENCES:
patent: 3660726 (1972-05-01), Ammon
patent: 4242719 (1980-12-01), Conley
patent: 5260519 (1993-11-01), Knickerbocker
patent: 5432675 (1995-07-01), Sorimachi
patent: 5487218 (1996-01-01), Bhatt
Coombs, "Printed Circuits Handbook" 3rd. Ed. p. 12.1., 1989.

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