Multilayer printed wiring board and method for producing the sam

Details Multilayer printed wiring board and method for producing the sam Multilayer printed wiring board and method for producing the sam

1987-05-29

1988-12-13

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361414, H05K 100

Patent

active

047912391

ABSTRACT:
A multilayer printed wiring board produced by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) through a first insulation laminate (12), and a second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern through through studs (15) and a second insulation laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.

REFERENCES:
patent: 4371744 (1983-02-01), Badet et al.
patent: 4417393 (1983-11-01), Becker
patent: 4490429 (1984-12-01), Tosaki et al.
patent: 4529835 (1985-07-01), Mizuno
patent: 4604496 (1986-08-01), Ishihara et al.
Haddad, M. C.; Metallizing Multilayer Ceramic Top and Bottom Side; IBM Technical Disclosure Bulletin; vol. 16, No. 11; Apr. 1974; p. 3612.

Affiliated with

Also associated with

Rating

Multilayer printed wiring board and method for producing the sam does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer printed wiring board and method for producing the sam, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed wiring board and method for producing the sam will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2197284