Multilayer printed wiring board and manufacturing method of...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S768000, C361S771000, C361S760000, C174S256000, C174S257000, C174S255000, C174S261000, C174S262000

Reexamination Certificate

active

07626829

ABSTRACT:
This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

REFERENCES:
patent: 6217987 (2001-04-01), Ono et al.
patent: 6365843 (2002-04-01), Shirai et al.
patent: 2001/0026888 (2001-10-01), Yokoyama et al.
patent: 2003/0052157 (2003-03-01), Wunderlich et al.
patent: 2003/0164303 (2003-09-01), Huang et al.
patent: 2004/0060169 (2004-04-01), Yokoyama et al.
patent: 2004/0226745 (2004-11-01), En
patent: 2005/0039948 (2005-02-01), Asai et al.
patent: 1 194 022 (2002-04-01), None
patent: 2 300 524 (1996-11-01), None
patent: 10-013028 (1998-01-01), None
patent: 2001-283805 (2001-10-01), None
patent: 2002-134885 (2002-05-01), None
patent: 2004-172415 (2004-06-01), None
patent: 2004-207381 (2004-07-01), None
patent: 2001-0041267 (2001-05-01), None
patent: WO99/44403 (1999-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multilayer printed wiring board and manufacturing method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer printed wiring board and manufacturing method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed wiring board and manufacturing method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4145833

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.