Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-10-17
2009-12-01
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S768000, C361S771000, C361S760000, C174S256000, C174S257000, C174S255000, C174S261000, C174S262000
Reexamination Certificate
active
07626829
ABSTRACT:
This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.
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Aoyama Masakazu
Nakamura Takenobu
Takahashi Michimasa
Watanabe Yasuhiro
Yanagisawa Hiroyuki
IBIDEN Co., Ltd.
Nguyen Hoa C
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Reichard Dean A.
LandOfFree
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