Multilayer printed wiring board and manufacturing method...

Details Multilayer printed wiring board and manufacturing method... Multilayer printed wiring board and manufacturing method...

2011-06-07

2011-06-07

Patel, Ishwarbhai B (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

07956293

ABSTRACT:
A multilayer printed wiring board is characterized in that the interlayer connection material in the via holes has a lower coefficient of thermal expansion in the thickness direction than the electrically insulating substrate made of insulating material; the interlayer connection is formed at a temperature higher than the operating temperature; and the interlayer connection material is larger in thickness than the interlayer connection material of the same wiring layer at normal temperature. This causes a difference in the coefficient of thermal expansion between the different materials in the thickness direction of the printed wiring board in the environment in which it is used resulting in high connection reliability.

REFERENCES:
patent: 6010769 (2000-01-01), Sasaoka et al.
patent: 7312400 (2007-12-01), Ito et al.
patent: 2004/0231151 (2004-11-01), Nakatani et al.
patent: 59-175796 (1984-10-01), None
patent: 2001-094256 (2001-04-01), None
patent: 2003-198086 (2003-07-01), None
Japanese Search Report for Application No. PCT/JP2007/057394, dated Jun. 26, 2007.

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