Multilayer printed wiring board and its manufacturing method

Details Multilayer printed wiring board and its manufacturing method Multilayer printed wiring board and its manufacturing method

2005-01-25

2005-01-25

Cuneo, Kamand (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S265000, C174S266000, C361S795000

Reexamination Certificate

active

06846993

ABSTRACT:
A conductive film has a plurality of clearances (openings) and a plurality of auxiliary clearances. The plurality of clearances and the plurality of auxiliary clearances are formed to have such numerical apertures and locations that generate no bias in the distribution of conductive film in consideration of the entire conductive film. The conductive film can disperse stress caused by thermal expansion etc., to ease by having the plurality of clearances and the plurality of auxiliary clearances. Accordingly, the conductive film is less prone to being peeled off the insulating film. Further, since the distribution of conductive film is substantially uniform as a whole, the transfer characteristics that are fixed by the distribution become substantially uniform as a whole.

REFERENCES:
patent: 5451720 (1995-09-01), Estes et al.
patent: 6184478 (2001-02-01), Imano et al.
patent: 6388206 (2002-05-01), Dove et al.
patent: 6486414 (2002-11-01), Kobayashi et al.
patent: 6521842 (2003-02-01), Brinthaupt et al.
patent: 6727435 (2004-04-01), Egan et al.
patent: 57-149789 (1982-09-01), None
patent: 59-161897 (1984-09-01), None
patent: 61-220398 (1986-09-01), None

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