Multilayer printed wiring board and its manufacturing...

Details Multilayer printed wiring board and its manufacturing... Multilayer printed wiring board and its manufacturing...

1990-10-12

2009-10-27

Lam, Cathy (Department: 1794)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S901000, C174S255000, C174S257000, C174S262000, C174S264000, C174S266000, C174S001000

Reissue Patent

active

RE040947

ABSTRACT:
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.

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English language abstract JP 6-275959.
English language abstract JP 6-302956.
English language abstract JP 5-67670.
English language abstract JP 4-303937.
English language abstract JP 63-52112.
English language abstract JP 6-76474.
English language abstract JP 5-198909.
English language abstract JP 7-162158.
English language abstract JP 1-100996.
English language abstract of JP 8-83971.
English language abstract of-JP-6-338218.
English language abstract of-7-188931.
English language abstract of-JP-7-283538.
English language abstract of-JP-9-116273.
English language abstract of-JP-6-069648.
English language abstract of-JP-9-130050.
English language abstract of-JP-6-283860.
English language abstract of-JP-5-110254.
English language abstract of JP 9-181415.
English language abstract of JP 9-8424.
English language abstract of JP 2-196494.
English language abstract of JP 1-143292.
English language abstract of JP 4-92496.
English language abstract of JP 5-243728.
English Language Abstract of JP 63-66993.
English Language Abstract of JP 4-27194.
English Language Abstract of JP 10-22611.

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