Multilayer printed wiring board

Details Multilayer printed wiring board Multilayer printed wiring board

2011-06-07

2011-06-07

Patel, Ishwarbhai B (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

07956291

ABSTRACT:
In a core substrate30, a ground through hole36E and a power through hole36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out each other. As a result, even if mutual inductance is reduced and a high frequency IC chip is loaded, electric characteristic and reliability can be improved without generating malfunction or error.

REFERENCES:
patent: 5488542 (1996-01-01), Ito
patent: 5774340 (1998-06-01), Chang et al.
patent: 5847936 (1998-12-01), Forehand et al.
patent: 6323435 (2001-11-01), Strandberg et al.
patent: 6323439 (2001-11-01), Kambe et al.
patent: 6333857 (2001-12-01), Kanbe et al.
patent: 6970362 (2005-11-01), Chakravorty
patent: 2002/0085334 (2002-07-01), Figueroa et al.
patent: 2003/0011070 (2003-01-01), Iijima et al.
patent: 2004/0169198 (2004-09-01), Nagata et al.
patent: 1 194 022 (2002-04-01), None
patent: 6-260756 (1994-09-01), None
patent: 6-275959 (1994-09-01), None
patent: 11-054927 (1999-02-01), None
patent: 2000-101245 (2000-04-01), None
patent: 2000-244129 (2000-09-01), None
patent: 2000-244130 (2000-09-01), None
patent: 2001-044591 (2001-02-01), None
patent: 2001-168531 (2001-06-01), None
patent: 2002-204077 (2002-07-01), None
patent: 2002-353365 (2002-12-01), None
patent: 1999-6770 (1999-01-01), None
patent: 1999-0064701 (1999-08-01), None

Affiliated with

Also associated with

Rating

Multilayer printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2642448