Multilayer printed wiring board

Details Multilayer printed wiring board Multilayer printed wiring board

2011-07-19

2011-07-19

Patel, Ishwarbhai B (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

07982139

ABSTRACT:
A multilayer printed wiring board10includes: a mounting portion60on the top surface of which is mounted a semiconductor element that is electrically connected to a wiring pattern32, etc.; and a capacitor portion40having a high dielectric constant layer43, formed of ceramic and first and second layer electrodes41and42that sandwich the high dielectric constant layer43. One of either of the first and second layer electrodes41and42is connected to a power supply line of the semiconductor element and the other of either of the first and second layer electrodes41and42is connected to a ground line. In this multilayer printed wiring board10, high dielectric constant layer43included in the layered capacitor portion40, which is connected between the power supply line and the ground line, is formed of ceramic. With this structure, the static capacitance of the layered capacitor portion40can be high, and an adequate decoupling effect is exhibited even under circumstances in which instantaneous potential drops occur readily.

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