Multilayer printed wiring board

Details Multilayer printed wiring board Multilayer printed wiring board

1986-11-13

1987-09-08

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 2281801, 2281802, 361412, H05K 114

Patent

active

046928430

ABSTRACT:
A multilayer printed wiring board having an air gap between neighboring printed wiring boards of the multilayer printed wiring board by inserting plated spacers to both end faces of through-hole pads which are provided to each printed wiring board so that each through-hole pad opposes to another through-hole pad on the neighboring printed wiring board. The spacers opposed to each other are joined together by solder, and each spacer has an end surface having a size being smaller than a size of the end surface of each through-hole pad to provide a drop part at the joint part of the spacers, so that melted solder stays at the drop part not flowing toward the board through the side surface of the through-hole pad when the printed wiring boards are integrated to the multilayer printed wiring board under pressure and high temperature.

REFERENCES:
patent: 3537136 (1970-11-01), Healy et al.
patent: 3591839 (1971-07-01), Evans
patent: 3616532 (1971-11-01), Beck
patent: 3829601 (1974-08-01), Jeannote et al.
patent: 3904934 (1975-09-01), Martin
patent: 3936930 (1976-02-01), Stern
patent: 4216350 (1980-08-01), Reid
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patent: 4368503 (1983-01-01), Kurosawa et al.
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patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4581680 (1986-04-01), Garner
patent: 4642889 (1987-02-01), Grabbe
Mescia et al., Interconnection for Stacked Substrates Having Integrated Chips, IBM. Tech. Disc. Bull., V. 16 #1, Jun. 1973, p. 38.

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